PART |
Description |
Maker |
EST568M016AM3AA |
Aluminum Electrolytic, 105C LowZ, EST, 5600 uF, 20%, 16 V, -40/ 105C, Lead Spacing = 7.5mm
|
Kemet Corporation
|
ALS80A433NF100 |
Aluminum Electrolytic, 105C, ALS80, 0.043 F, 20%, 100 V, -40/ 105C
|
Kemet Corporation
|
ELG687M250AR6AA |
Aluminum Electrolytic, 105C, ELG, 680 uF, 20%, 250 V, -25/ 105C
|
Kemet Corporation
|
PEH532VCD3270M2 |
Aluminum Electrolytic, 105C, PEH532, 270 uF, 20%, 400 V, -40/ 105C
|
Kemet Corporation
|
ELG478M050AS2AA |
Aluminum Electrolytic, 105C, ELG, 4700 uF, 20%, 50 V, -40/ 105C
|
Kemet Corporation
|
ELG688M050AR6AV |
Aluminum Electrolytic, 105C, ELG, 6800 uF, 20%, 50 V, -40/ 105C
|
Kemet Corporation
|
ALS80A103DB063 |
Aluminum Electrolytic, 105C, ALS80, 0.01 F, 20%, 63 V, -40/ 105C
|
Kemet Corporation
|
PUMA67S16000M-025 PUMA2S16000I-45 PUMA67S16000I-45 |
150NS, PLCC, COM TEMP(FLASH) 15NS, 44 PLCC, COM TEMP(EPLD) 30MHZ, 3.3V, 8 LAP, COM TEMP(FPGA) 20NS, 44 PLCC, COM TEMP(EPLD) 150NS, TSOP, IND TEMP(FLASH) 20NS, 44 TQFP, IND TEMP(EPLD) 120NS, SOIC, IND TEMP(EEPROM) 70NS, TSOP, IND TEMP(EEPROM) 15NS, 68 PLCC, IND TEMP(EPLD) 25NS, 68 PLCC, IND TEMP(EPLD) 30MHZ, 32 TQFP, COM TEMP(FPGA) 120NS, PDIP, IND TEMP(EEPROM) 32 MCROCELL CPLD 1.8V ISP TQFP IND GREEN(EPLD) x32 SRAM Module X32号的SRAM模块 90NS, TSOP, IND TEMP(EEPROM) X32号的SRAM模块 120NS, PLCC, IND TEMP(EEPROM)
|
DB Lectro, Inc. TE Connectivity, Ltd.
|
EKZM350ESS101MF11D EKZM350ESS102MK20S EKZM350ESS12 |
Low impedance, 105C
|
United Chemi-Con, Inc.
|
A758KK827M0JAAE013 |
Polymer Aluminum, 105C LowZ, A758, 820 uF, 20%, 6.3 V, -55/ 105C, Lead Spacing = 3.5mm
|
Kemet Corporation
|
EST108M050AM7AA |
Aluminum Electrolytic, 105C LowZ, EST, 1000 uF, 20%, 50 V, -40/ 105C, Lead Spacing = 7.5mm
|
Kemet Corporation
|
|